Micromachined Quantum Circuits

Micromachined Quantum CircuitsContinued progress in quantum computing in the circuit quantum electrodynamics (cQED) platform will require adapting sophisticated 3D integration and RF packaging techniques found in today's high density classical devices. This thesis describes multilayer microwave integrated quantum circuits (MMIQCs) that combine the superb coherence of three dimensional structures with the advantages of lithographic integrated circuit fabrication. Several design and

Continued progress in quantum computing in the circuit quantum electrodynamics (cQED) platform will require adapting sophisticated 3D integration and RF packaging techniques found in today's high-density classical devices.
This thesis describes multilayer microwave integrated quantum circuits (MMIQCs) that combine the superb coherence of three-dimensional structures with the advantages of lithographic integrated circuit fabrication. Several design and fabrication techniques are essential to this new physical architecture, notably micromachining, superconducting wafer bonding, and out-of-plane qubit coupling. This thesis explores these techniques and culminates in the design, fabrication, and measurement of a two-cavity/one-qubit MMIQC featuring qubit coupling to a superconducting micromachined cavity resonator in silicon wafers.