EMCP221 Flip Shrapnel To USB Test Socket Burn Socket

EMCP221 Flip Shrapnel To USB Test Socket Burn Socket1. Type: Test block 2. Working frequency: High frequency 3. Application: integrated circuit IC 4. Interface type: Terminal 5. Production process: Injection molding 6. Features: Stable testing 7. Contact material: Beryllium copper shrapnel 8. Insulator material: PET 9. Number of cores: 38 10. Purpose: Programming socket, test socket, to test, read and write the IC chip of EMCP221 11. Lead spacing: 0. 5mm 12. Service life: 100,000 times 13. Chip size:

1. Type: Test block
2. Working frequency: High frequency
3. Application: integrated circuit IC
4. Interface type: Terminal
5. Production process: Injection molding
6. Features: Stable testing
7. Contact material: Beryllium copper shrapnel
8. Insulator material: PET
9. Number of cores: 38
10. Purpose: Programming socket, test socket, to test, read and write the IC chip of EMCP221
11. Lead spacing: 0.5mm
12. Service life: 100,000 times
13. Chip size: 11.5x13cm

Testing Method:
1. Select the limit frame that matches the IC, and place the IC flat in the SOCKET according to the direction
2. Plug the USB cable into the USB port of the computer, turn on the power switch of the socket, and select the corresponding test program

Features:
1. Also compatible with 186-FBGA 162-FBGA
2. The shrapnel is made of imported beryllium copper by high-precision die stamping, and the head-shaped probe is designed to be hardened and thickened in the later stage to ensure product stability and durability.
3. Support hot plugging and separate power switch, support for testing through USB interface or connection with the board on the board according to the PIN
4. Using floating board structure, precise positioning, convenient IC picking and placement, higher work efficiency
5. The test board is welded to the adapter board, the test socket does not need to be soldered, and the pinholes are inserted into the adapter board